Reference Summary: With the rapid growth of AIGC and AI applications, devices are demanding ever-higher chip performance. There's a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now:

Advanced Packaging 1 2 Tsmc -

With the rapid growth of AIGC and AI applications, devices are demanding ever-higher chip performance. There's a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now: The most powerful AI chips in the world depend on just a few factories.

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  • With the rapid growth of AIGC and AI applications, devices are demanding ever-higher chip performance.
  • There's a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now:
  • The most powerful AI chips in the world depend on just a few factories.

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